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Iesaki Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX

Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX
Hi-Fi 3DHi-Fi 3D Technology enables high definition multi-dimensional sound where it matters the most with height, width and depth in front of the listener. It's based on the physics of reproduced sound and the basic human perception of sound. The high resolution sound reproduction stands above existing sound enhancements or virtualization technologies.
Blu-ray AudioUpgrading your Audio performance in the easiest way is choosing BIOSTAR ultimate Motherboard. It does support Blu-ray audio DRM (compatible driver/software) and provide the higher audio output of 24 bit/ 192KHz than the 16 bit/ 48KHz from the normal MB. You will experience the high quality sound effect with pure Blu-Ray Audio.
Super Hi-Fi Audio Connectors30uF “Golden” plated audio connectors provide superb signal conductivity, less oxidation, and best possible studio-grade headgears.
Hi-Fi AMP 3DWith the built-in new generation 3D amplifier, Biostar Hi-Fi 3D motherboard can drive major high-end headphones with over 100dB loads and up to 600ohm impedance. It allows you enjoy a fuller range of dynamic sound with crisper details and less distortion when you are using any headphones.
Smart Ear 3DSmart Ear 3D provides true reproduction of virtual 3D space using any headphones! It delivers the true 3D sounds for music, movies and also games. It's fantastically, especially if you've never experienced this kind of acoustic phenomenon before.
Hi-Fi Pre AMPHi-Fi 3D Technology is built-in power amplifier to boost the speaker volume. It will increase double volume level with high-quality HD audio output. Hi-Fi 3D Technology not only improves on the headphone but also enhances your speakers' sound volume.Hi-Fi preamp can boost the line level audio signals from analog and digital sources to levels that a power amplifier can detect and boost again to successfully power up the loadspeaker.
3D Sound FieldsThe six types of 3D Sound Fields are including Hi-Fi Theater, Hi-Fi Hall, Hi-Fi Game spots, Hi-Fi Studio, Hi-Fi Conference and Hi-Fi Bistro for your different applications. Biostar Hi-Fi 3D technology involves the virtaul placement of sound sources anywhere in 3 dimensional spaces, including behind, above or below.
Hi-V CapsHi-V Caps is "Metalized Polypropylene Film Capacitor" for each audio channel circuit. The customized audio capacitors deliver low noise, low distortion and wide bandwidth to achieve the highest sound resolution and sound expansion.
Hi-Fi PowerAudio power is an important factor in audio quality. Most AV equipment isolates the power supply for each analog and digital signal to gather high-quality sound reproduction. Equipped with BIOSTAR Hi-Fi Power technology, it will utilize audio components with independent power design for a significant reduction in electronic noise and superb sound quality.
Hi-Fi GroundBIOSTAR Hi-Fi Ground ( Golden Line ) is noise-blocking multi-layer PCB design to isolates analog audio signals from digital sources. Unique PCB layout is ideal for exceptional clarity and high fidelity sound.
Hi-Fi 110dB+Embrace exceptional sound quality for the win with 110dB SNR and stylish and efficient EMI shield blocks electromagnetic interference to help provide cleaner audio. It has achieved a signal-to-noise ratio (SNR) of 110dB, yielding almost loss-less audio form rear audio connectors.
HDMI 4K2KThe new 4K2K resolution enables high-definition image display with four times the resolution of full HD ,4K2K display is faithfully express bright, highly detailed content that fills the entire screen with lifelike images. Connectivity with PCs via a single HDMI cable for displaying 4K2K data.
DVIDVI is better than VGA for LCD displays since it is digital while VGA is analog. For LCD displays, the picture is digitized pixel per pixel. Through DVI, the panel gets data for each pixel, so the picture generated in the Graphics device matches the pixels on the panel itself.
DisplayPortDisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio.
DX12DirectX 12 introduces the next version of Direct3D, the graphics API at the heart of DirectX. Direct3D is one of the most critical pieces of a game or game engine, and we've redesigned it to be faster and more efficient than ever before. Direct3D 12 enables richer scenes, more objects, and full utilization of modern GPU hardware.
PCI-e M.2 32Gb/sPCI-e M.2 32Gb/s is the latest storage interface, it delivers the highest bandwidth and lower latency. It's 3 times faster compared with PCI-e M.2 10Gb/s.
SmartSpeedLANSmartSpeedLAN is a free software application which monitors and manages your PC's network behavior. With user-friendly GUI, it allows you to select and prioritize different types of network traffic, including gaming, media streaming, communications or web surfing.You can also set any specific applications, choosing to prioritize or block accordingly. SmartSpeedLAN can feature automatic management options that use adaptive networking intelligence to ensure that you are getting the best online experience possible.
Charger Booster IICharger booster 2, with maximum voltage up to 2A which provides a quicker charging time on various portable devices.
PCI-E Gen 3.0PCI-E 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCI-E 2.0, while preserving compatibility with software and mechanical interfaces.
SATA Express 16Gb/sNew generation SATA Express standard with speed up to 16Gb/s and meets SATA specifications.
USB 3.0Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.
Super Durable Ferrite ChokeSuper Durable Ferrite Choke brings the benefits of higher current capacity, lower energy loss and better power stability.
Super Durable Solid CapsThe best quality solid state capacitors with ultra low ESR design, the Super Durable Solid Caps doubles the lifespan.
Moistureproof PCBThe popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.
Low RdsOn P-Pak MOSLow resistance design can significantly reduce the current out of energy loss.Low temperature, small size, excellent thermal conductivity. Super Conductive Heatsink DesignMassive heatsink design provides super fast heat dissipation, high stability and reliability for extreme performance.
100% Solid CapsWith armor-plated Biostar Technology, all capacitors are placed with 100% solid capacitors that have a lasting life cycle, durability and stability for crucial components.
Super Anti-Surge ProtectionBIOSTAR exclusive Anti-Surge design provides the best protection of board and extends the product life. Having the latest model of "Transient Voltage Suppressor" on- board can effectively protect the board circuit, reducing the shocks caused by ESD as well as other damages arising from overvoltage transients to enhance system durability.
Super LAN Surge ProtectionSuper LAN Surge Protection, providing LAN port with more advanced antistatic protection capabilities by adding an integrated chip to strengthen electrical stability and prevent damage from lightning strikes and electrical surges. SLSP (Super LAN Surge Protection) series motherboard upgrades the existing system protection standards with maximum 4X protection comparing to other board makers.
ESD ProtectionESD (Electrostatic Discharge) is the major factor to destroy PC by electrical overstress(EOS) condition, ESD occurred by PC users when touch any devices connect to PC, which may result in damage to motherboard or parts .ESD protection is designed to protect the motherboard and equipment from damage by EOS
USB PolyswitchOn board dedicated power fuse to help prevent USB port failure. It prevents USB Port overcurrent and safegurand your system and device lifespan.
BIOS Virus ProtectionWhen enabled, the BIOS will protect the boot sector and partition table by halting the system and flashing a warning message whether there's an attempt to write to these areas.
OC / OV / OH ProtectionAll BIOSTAR special circuit design detects overvoltage conditions and prevents voltage surges from spreading in real time. It also actively cuts off the overvoltage supply to protect your system. Over current protection, avoid motherboard from damage when doing overclock or an unusual current import. Over heat protection, avoid motherboard & CPU from burning when exceeding the temperature limitation.
High Quality ESDBIOSTAR Hi-Fi series motherboards provide high quality ESD (Electro-Static Discharge) solution for its front I/O panel. This function prevents static electricity and reduces the damage to the motherboards when you are plugging or unplugging your headphone.
GAMING COMMANDERExternal GAMING COMMANDER BOX features an independent USB DAC, dedicated MIC_IN and Line-out jacks, Buttons for volume adjustments, Diagnose LED for CPU/ DDR/ VGA temperature indicator, and exclusive XLouder button for quick MIC boost. GAMING COMMANDER software is a user friendly interface with equalizer function which allows users to make his own voice effects while enjoying the games.
UEFI BIOSUnified Extensible Firmware Interface (UEFI) is a brand new framework that provides a revolutionary interface. It is a modern clear and easy-to-use graphical user interface. The UEFI comes with a colorful easy-understand icons leads users into the setup layer directly.
Header ZoneUsers can easily assemble their own computer, a simple-swap data discs and other accessories.
BIO-Remote 2BIO-Remote2 Technology is featuring users a better Home Theater environment. Users who own either Android mobile or Apple goods are able to access and control your PC remotely; At this moment, you’re smart device became a intelligent and functional remote controller; more than that, BIO-Remote2 also includes both function of mouse pad and power point presentation mode.
Super Rapid Debug 3Super Rapid Debug 3 posts critical POST code information on a vivid digital LED display.
Super Durable Box HeaderSuper Durable Box Header provides solid, secure and durable connections between motherboard and peripheral cables.
Intel H170 chipsetThe Intel H170 chipset is a single-chipset design to support socket 1151 Intel 6th generation Intel Core processor-based platform. Provides excellent performance and increased bandwidth and stability. Intel H170 chipset can also enable iGPU function, letting users enjoy the latest Intel integrated graphic performance. The PC platform features improved adaptive performance that adds speed when you need it. When combined with advanced system responsiveness, the platform delivers the ultimate PC experience.
Intel LGA 1151 6th Generation Intel Core Processor supportThe 6th generation Intel Core processors are based on 5th generation Intel Core processor architecture, with the latest 14nm process to maximize the processor platform. Based on the new LGA 1151 socket, 5th generation Intel Core processors with graphics with DX12 & OCL2.0 cores , the overall performance will meet your demand.
Atmiņas veids
Atmiņas slotu tips
Atmiņas kanālu atbalsts
Kopnes ātrums
1600,1866 MHz
Maksimālā iekšējā atmiņa
32 GB
Procesora tips
Savietojami procesori
Core i3, Core i5, Core i7, Pentium
Procesora ligzda
USB 2.0 savienotāji
S/PDIF out savienotājs
CPU ventilatora savienojums
Priekšējā paneļa audio savienotājs
USB 2.0 pieslēgvietu skaits
Ethernet LAN (RJ-45) ports
PS/2 pieslēgvietu skaits
VGA (D-Sub) pieslēgvietu skaits
Komponente paredzēta
Mikroshēmu kopnes saime
Mikroshēmu kopne (chipset)
Intel Z170
Mātes plates formas faktors
Atbalstāmie cietā diska interfeisi
Serial ATA III
Audio izvades kanāls
Audio sistēma
Realtek ALC892
PCI Express x16 (Gen 3.x) slots
Ethernet/LAN savienojums
LAN kontrollers
Intel I219-V, Realtek RTL8111H
Ethernet interfeisa tips
Gigabit Ethernet
Windows OS atbalsts
Windows 10 Education x64, Windows 10 Enterprise x64, Windows 10 Home x64, Windows 10 Pro x64, Windows 7 Enterprise, Windows 7 Enterprise x64, Windows 7 Home Basic, Windows 7 Home Basic x64, Windows 7 Home Premium, Windows 7 Home Premium x64, Windows 7 Pro
BIOS tips
USB 3.0
SATA 3 konektori
PCI sloti
Pievienoti kabeļi
DVI-D pieslēgvietu skaits
HDMI pieslēgvietu skaits
RAID līmeņi
0, 1, 5, 10
30,5 cm
24,4 cm
DirectX versija
Draiveri iekļauti
Iekļautā programmatūra
BullGuard, Smart Ear 3D, BIO-Remote2, Smart Speed LAN, Intel Rapid Start Technology, Intel Smart Connect Technology, Intel Rapid Storage Technology(include Intel Smart Response Technology)
Audio izeja
Displeja ports
Processor thermal power (max)
95 W
GAME/MIDI savienotājs
PCI Express x1 (Gen 3.x) slots
Number of M.2 (M) slots
Number of SATA Express connectors
USB 3.0 (3.1 Gen 1) Type-A ports quantity
Citas funkcijas
Supports PURO Hi-Fi 3D, Touch Button, Supports 100% Solid capacitor, Supports Rapid Debug3, Supports Charger Booster II, Supports BIOS Online Update
Number of DIMM slots
Meklēt Biostar Gaming H170T, H170, DDR3, SATA3, USB 3.0, ATX internetā: Google | Yandex
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