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Iesaki IBM Express x3250 M5 Xeon 4C E3-1220v3 (5458E1G)

IBM Express x3250 M5 Xeon 4C E3-1220v3 (5458E1G) IBM Express x3250 M5 Xeon 4C E3-1220v3 (5458E1G)
- Enhanced performance advantages in a space-saving form factor- Improved flexibility for faster, simpler expansion as you need it- Entry-level server needs with proven reliability, manageability and value- Groundbreaking system storage density in a 1U entry-level server- Innovative technology with the latest processors and large memory capacity, in a compact 1U footprint- Power-efficient and 80 PLUS®-compliant design to help save energy costs- Affordable price point and total cost of ownership
The System x3250 M5 is the most compact rack server in the System x® portfolio. Designed in a single-socket 1U form factor, it supports double the system storage density of its predecessor in the same 22-inch deep chassis—four 3.5-inch hard disk drives (HDDs) or up to eight 2.5-inch SAS/SATA HDDs.1 Choose the latest Intel® processor that best matches your workloads, whether Intel Xeon® E3-1200 v3 series, Core i3, or Pentium, including Xeon Data Center Graphics processors. With increasing focus on data security, the included Trusted Platform Module (TPM) can help safely store cryptographic keys.
Expand with simplicity—on your timetable
After activating the Integrated Management Module 2 (IMM2) standard on your server, you can use Feature on Demand (FoD) for several upgrades. For example, using FoD you can easily enable two more Gigabit Ethernet (GbE) ports, in addition to the two standard ports, without opening your system hardware. You can also upgrade the speed and security of the ServeRAID™ C100 RAID-5 upgrade within the FoD key activation system. Furthermore, by using FoD for upgrades, your two PCIe x8 expansion slots remain free for other upgrade options as your business grows.
Product features
- Groundbreaking HDD density in a 1-U entry-level server.- Innovative technology with the latest processors and large memory capacity, in a compact 1U footprint- Power-efficient design helps save on energy costs- Affordable price point and total cost of ownership- Integrated tools support easy deployment and management- Tested and certified for quality and reliability- Rich security features to meet today’s security requirements
Ražotājs
Lenovo
Augstums
4,3 cm
Platums
43,5 cm
Dziļums
57,6 cm
USB 2.0 pieslēgvietu skaits
4
Supported hard disk drive sizes
3.5"
Barošanas avots
300 W
Darbības temperatūras amplitūda (T-T)
10 - 35 °C
Darbības relatīvā mitruma amplitūda
8 - 80%
Uzglabāšanas relatīvā mitruma amplitūda
8 - 80%
Seriālo pieslēgvietu skaits
1
Atbalstāmo cieto disku skaits
4
Karstā pārnese (hot-swap)
Procesora ligzda
LGA 1150
Procesora tips
Intel Xeon
Savietojami procesori
Xeon
RAID līmeņi
0, 1
Ethernet/LAN savienojums
VGA (D-Sub) pieslēgvietu skaits
1
Ethernet LAN (RJ-45) ports
2
Integrēta videokarte
None
CPU configuration (max)
1
Redundant power supply (RPS) atbalsta
Procesora ražotājs
Intel
Maksimālā iekšējā atmiņa
32 GB
Ethernet interfeisa tips
Gigabit
Procesora taktātrums
3.1 GHz
Procesors
E3-1220V3
Procesora kodolu skaits
4
Instalēto procesoru skaits
1
Cache type
Smart Cache, L3
Procesora kešatmiņa
8 MB
Maksimālā frekvence (Turbo Boost)
3.5 GHz
Procesora tehnoloģija
22 nm
Processor threads
4
Processor operating modes
64-bit
Soļu izpildījums
C0
Bus type
DMI
Number of QPI links
1
Processor codename
Haswell
Maximum internal memory supported by processor
32 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
1333,1600 MHz
Memory bandwidth supported by processor (max)
25,6 GB/s
Memory channels supported by processor
Duāls
ECC supported by processor
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Maximum number of PCI Express lanes
16
PCI Express сonfigurations
1x8, 1x16, 2x4, 2x8
Processor package size
37.5
Atbalstāmie instrukciju komplekti
AVX 2.0, SSE4.1, SSE4.2
Scalability
1S
Embedded options available
Thermal solution specification
PCG 2013D
Graphics & IMC lithography
22 nm
Thermal Design Power (TDP)
80 W
Processor series
Intel Xeon E3-1200 v3
Conflict Free processor
RAID support
Maksimālā uzglabāšanas ietilpība
24 TB
Operatīvā atmiņa
4 GB
Atmiņas sloti
4
Atmiņas taktātrums
1600 MHz
Grafiskais adapteris
G200eR2
Grafiskā adaptera saime
Matrox
Pieslēgums
10/100/1000Base-T(X)
PCI Express slotu versija
3.0
Korpusa veids
Rack (1U)
Number of main power supplies
1
Intel Rapid Storage Technology
Enhanced Intel SpeedStep Technology
Intel Identity Protection Technology
Intel Wireless Display (WiDi) Technology
Intel Virtualization Technology for Directed I/O (VT-d)
Intel Anti-Theft Technology
Intel Hyper-Threading Technology
Intel My WiFi Technology
Intel Turbo Boost Technology
2.0
Intel vPro Technology
Intel Quick Sync Video Technology
Intel InTru 3D Technology
Intel Clear Video HD Technology
Intel Insider
Intel Flex Memory Access
Intel AES New Instructions
Intel Trusted Execution Technology
Intel Enhanced Halt State
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel Secure Key
Intel TSX-NI
Intel Clear Video Technology
Intel Clear Video Technology for MID
Intel 64
Intel Identity Protection Technology version
1.00
Intel Stable Image Platform Program (SIPP) version
1.00
Intel Secure Key Technology version
1.00
Intel Virtualization Technology (VT-x)
Intel TSX-NI version
1.00
Intel Dual Display Capable Technology
Intel FDI Technology
Intel Fast Memory Access
USB 3.0 (3.1 Gen 1) Type-A ports quantity
2
Maksimālā grafiskā adaptera atmiņa
16 MB
Intelligent Platform Management Interface (IPMI) support
Trusted Platform Module (TPM)
Datu pārraides ātrums
5 GT/s
Ekspluatācijas augstums
0 - 2134 m
Nodrošināta operētājsistēma
Nav
Intel Virtualization Technology
VT-d, VT-x
Atmiņas izkārtojums
1 x 4 GB
PCI Express x4 (Gen 3.x) slots
1

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